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Epoxy Modified Silicone Resin
Chemical Name: | Epoxy Modified Silicone Resin |
Product Category: | Silicone Resin – Product |
Appearance: | Colorless transparent to light yellow liquid. |
Viscosity, cst: | 50-100 (closed 4 cup) |
Solid content: | 55±1 % |
Curing conditions: | Surface dry at room temperature, fully cured with 250℃ for 20mins. |
Heat resistance: | ≥200h (varnish sheet) Tinplate sheet (200℃) |
Epoxy value: | 0.02-0.07 |
Solvent: | xylene/butanol |
Epoxy Modified Silicone Resin Describe
Epoxy modified silicone resin has excellent high and low temperature resistance, waterproof and moisture-proof properties and good electrical insulation properties. After complete curing, this product has high hardness (≥2H), high gloss, good fullness and high temperature resistance.
Epoxy modified silicone resin, silicone resin, Epoxy silicone resin
Product description
Epoxy modified silicone resin has excellent resistance in high and low temperature, water and moisture resistance and good electrical insulation properties. After fully cured, this product has high hardness (≥2H), high gloss, good fullness, and high temperature resistance.
Technical index
Appearance: light yellow to yellow transparent liquid, allowing milky white light without mechanical impuritiesViscosity, cst (closed 4 cup): 50-100Solid content,%: 55±1Curing conditions: Surface dry at room temperature, fully cured with 250℃ for 20mins.Heat resistance (varnish sheet) Tinplate sheet (200℃): ≥200hEpoxy value: 0.02-0.07Solvent: xylene/butanol
Precautions:
Storage:
Packaging, storage and transportation
Product description
Epoxy modified silicone resin has excellent resistance in high and low temperature, water and moisture resistance and good electrical insulation properties. After fully cured, this product has high hardness (≥2H), high gloss, good fullness, and high temperature resistance.
Technical index
Appearance: light yellow to yellow transparent liquid, allowing milky white light without mechanical impuritiesViscosity, cst (closed 4 cup): 50-100Solid content,%: 55±1Curing conditions: Surface dry at room temperature, fully cured with 250℃ for 20mins.Heat resistance (varnish sheet) Tinplate sheet (200℃): ≥200hEpoxy value: 0.02-0.07Solvent: xylene/butanol
Precautions:
- The dilution solvent used in this product must not contain water, sulfur-containing compound pyridine and its impurities, otherwise it will affect the adhesion, dryness and other properties of the resin paint film.
- During the processing of this product, a large amount of flammable and explosive solvents will volatilize. Attention should be paid to strengthening the ventilation on site,paying attention to fire prevention, and strictly cutting off the fire source. Operators should pay attention to labor protection.
- The equipment and utensils used in the processing of this product must be clean. Strictly prevent the mixing of dust, foreign matter and water.
- Acids, alkalis, organic acid salts and amine compounds can accelerate the curing of this product and affect the heat resistance and electrical properties.
Storage:
- The storage period of this product is tentatively set for half a year.
- Epoxy silicone resin should be stored in a ventilated, cool and dry place to prevent direct sunlight; prevent serious pollution by acid and lye, and should isolate the fire source and keep away from the heat source.
Packaging, storage and transportation
- Epoxy silicone resin is packed in 20/200kg iron drum;
- This product should be stored in a ventilated, cool and dry place to prevent direct sunlight; prevent serious pollution of acid and lye, and should be isolated from fire and heat.
- The shelf life is one year.
Packaging Specifications
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Epoxy Modified Silicone Resin : Guide
Epoxy-modified silicone resin is widely used as high temperature resistant coatings (high temperature resistant up to 600℃) can be two-component curing at room temperature, also can be high temperature baking curing. It is the base resin for special coatings and H-class insulating coatings. The resin has excellent weather resistance, chemical stability and corrosion resistance.
Usage:
Room temperature two-component curing, used in conjunction with 650 polyamide or T-31. 650 is added at 10% of the total resin; T-31 is added at about 5% of the total resin. Add 5-10% KH550 of total resin.
It can get better high temperature. resistance after curing of silane coupling agent. Be careful that the solvent is not too weak. Butyl ester, PMA, butanol, etc. are recommended.
Usage:
Room temperature two-component curing, used in conjunction with 650 polyamide or T-31. 650 is added at 10% of the total resin; T-31 is added at about 5% of the total resin. Add 5-10% KH550 of total resin.
It can get better high temperature. resistance after curing of silane coupling agent. Be careful that the solvent is not too weak. Butyl ester, PMA, butanol, etc. are recommended.