3-Glycidoxypropylmethyldiethoxysilane
Chemical Name: | 3-Glycidoxypropylmethyldiethoxysilane |
Alias: | 3-(2,3-Epoxypropoxypropyl)methyldiethoxysilane |
Product Category: | CAS 2897-60-1 Epoxy Silane | Silanes |
CAS NO.: | 2897-60-1 |
Molecular formula: | C11H24O4Si |
EINECS: | 220-780-8 |
Molecular Weight: | 248.391 |
3-Glycidoxypropylmethyldiethoxysilane Description
3-Glycidoxypropylmethyldiethoxysilane (CAS 2897-60-1), also known as 3-(2,3-Epoxypropoxypropyl)methyldiethoxysilane, It is a clear, colorless liquid.CAS 2897-60- 1silane is an organofunctional silane used as an inorganic filler (powdered silica, glass, glass fibers, ceramics, etc.) in combination with a wide variety of polymers (e.g., epoxy, melamine, phenolic, and urethane resins, polystyrene plastics, acrylic sealants, butyl rubbers, and water-soluble polymers containing hydroxyl and/or primary or secondary amine groups.
Chemical name | 3-Glycidoxypropylmethyldiethoxy silane |
Synonyms | 3-(2,3-Epoxypropoxypropyl) methyldiethoxysilane |
Product Category | Epoxy-Containing Silanes – Silane Coupling Agent |
Density | 1.0±0.1 g/cm3 |
Boiling Point | 284.7±20.0 °C at 760 mmHg |
Melting Point | < 0ºC |
Molecular Formula | C11H24O4Si |
Molecular Weight | 248.391 |
Flash Point | 100.2±22.2 °C |
Exact Mass | 248.144379 |
Psas | 40.22000 |
Logp | 0.75 |
Appearance Traits | colorless transparent liquid |
Vapor Pressure | 0.0±0.6 mmHg at 25°C |
Refractive Index | 1.440 |
Storage Conditions | 2-8°C |
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3-Glycidoxypropylmethyldiethoxysilane : Guide
3-Glycidoxypropylmethyldiethoxysilane is an epoxy bifunctional organosilane with reactive epoxy groups and hydrolyzable inorganic ethoxymethylsilane groups. It provides storage-resistant, non-yellowing adhesion promoter performance while enhancing the physical properties of latex and water-based adhesive and sealant systems. When added as a crosslinker or adhesion promoter, it provides improved water resistance and wet bonding with good storage stability.
Applications:
1. Improving the dry and wet strength of cured composites reinforced with glass fiber untwisted roving.
2. Enhance wet electrical properties of epoxy encapsulation materials.
3. Eliminates the need for separate primers in polysulfide and polyurethane sealants.
4. Improves adhesion of waterborne acrylic sealants as well as urethane and epoxy coatings.
Applications:
1. Improving the dry and wet strength of cured composites reinforced with glass fiber untwisted roving.
2. Enhance wet electrical properties of epoxy encapsulation materials.
3. Eliminates the need for separate primers in polysulfide and polyurethane sealants.
4. Improves adhesion of waterborne acrylic sealants as well as urethane and epoxy coatings.